Huawei Y7 2019 / Y7 Prime 2019 / Y7 Pro 2019 (DUB‑LX1/LX2/LX3) and Enjoy 9 (DUB‑AL00/TL00/AL20)

Huawei Y7 2019 / Y7 Prime 2019 / Y7 Pro 2019 (DUB‑LX1/LX2/LX3) and Enjoy 9 (DUB‑AL00/TL00/AL20) Stock Firmware and Board Software [EMUI 8.2, Snapdragon 450]

The Huawei Y7 2019 family (including Y7 Prime 2019 and Y7 Pro 2019) and the China variant Enjoy 9 all run EMUI 8.2 on Android 8.1 and are built on the Qualcomm Snapdragon 450 platform, so recovery packages must match a Qualcomm flashing workflow rather than MediaTek or Kirin methods.

The packages include QPST/QFIL firehose builds, factory “Board Software” (BD 1.0.0.xx) for deep unbrick via EDL 9008, and full region builds (C432/C605/C636/C185) for normal restore or dload updates.

CRUCIAL WARNING: “Board Software” BD 1.0.0.5x/6x requires Qualcomm EDL (HS‑USB QDLoader 9008) access via testpoint on DUB mainboards; do not attempt SP Flash Tool or Kirin-only methods on these Snapdragon devices.

Flashing a mismatched region (cust) can switch the phone to C900 “open market” and disable OTA updates; stay within your cust (e.g., C432 EU, C605 LATAM, C636 Asia‑Pacific, C185 Middle East/Africa) to keep OTA continuity.

If you see “Software install failed” during dload/eRecovery, it typically indicates version or cust/anti‑rollback mismatch—use a same‑or‑newer build for your exact cust and retry with the proper update method.

Hardware differences matter: Y7 Pro 2019 (DUB‑LX2) launched without a fingerprint reader while Y7/Y7 Prime variants include it—firmware will not add missing hardware features.


Device information

DetailInformation
Device familyHuawei Y7 2019 / Y7 Prime 2019 / Y7 Pro 2019; Huawei Enjoy 9 (China)
Models in scopeDUB‑LX1 (Prime), DUB‑LX2 (Pro), DUB‑LX3 (Prime LATAM), DUB‑AL00/DUB‑TL00/DUB‑AL20 (Enjoy 9)
ChipsetQualcomm SDM450 Snapdragon 450, octa‑core 1.8 GHz Cortex‑A53, Adreno 506 GPU
SoftwareAndroid 8.1 (Oreo), EMUI 8.2 across this series at launch
Region codes (cust)C432 (Europe), C605 (Latin America), C636 (Asia Pacific), C185 (Middle East/Africa)
Package typesQPST/QFIL firehose packages; Board Software BD 1.0.0.xx for EDL; full dload/update builds per cust
Recommended toolsQFIL/QPST for EDL 9008 unbrick; Huawei dload/eRecovery for full update packages
Notable hardware noteDUB‑LX2 (Y7 Pro 2019) lacks fingerprint reader vs Y7/Prime siblings

Download packages

Select the build that matches your exact model and cust; use Board Software for deep unbrick in EDL, QPST/QFIL zips for firehose flashing, and full cust builds for region‑correct restores or dload updates.

FileTypeTarget modelsRegion/CUSTSizeNotes
DUB‑LX1/LX2/LX3/AL00 BD 1.0.0.58 Board SoftwareBoard Software (BD)DUB‑LX1/LX2/LX3/AL00General (BD)1.1 GBEDL 9008 unbrick via testpoint; use QFIL firehose from package
DUB‑LX BD 1.0.0.61 Board SoftwareBoard Software (BD)DUB‑LX seriesGeneral (BD)1.1 GBFor hard‑brick recovery when only 9008 is detected
Enjoy 9 DUB‑AL00/TL00 8.2.0.130DFull firmware (dload)DUB‑AL00/DUB‑TL00C00 (China)1.75 GBChina build; install via dload/eRecovery on Enjoy 9
DUB‑AL00/TL00 8.2.0.127(C00) all_cnFull firmware (dload)DUB‑AL00/DUB‑TL00C00 (China)4.12 GBMulti‑carrier China package for Enjoy 9
DUB‑LX1/L21 8.2.0.147(C432)Full firmware (dload)DUB‑LX1/DUB‑L21C432 (Europe)4.65 GBEU region build; preserves OTA when flashing same cust
DUB‑LX1 8.2.0.176(C185).zipFull firmware (dload)DUB‑LX1C185 (MEA)6.12 GBMEA package for SD‑card dload update
DUB‑LX1 8.2.0.176(C185CUSTC185D1)Full firmware (dload)DUB‑LX1C185 (MEA)2.6 GBAlternate MEA build; match cust to avoid C900
DUB‑LX/AL00 BD 1.0.0.58 (duplicate)Board Software (BD)DUB‑LX/AL00General (BD)1.1 GBDuplicate of first BD entry; same use case
DUB‑LX2 BD 1.0.0.61Board Software (BD)DUB‑LX2 (Y7 Pro 2019)General (BD)1.11 GBEDL board repair for LX2; no FP hardware on Pro variant
DUB‑LX2 8.2.0.130(C636)Full firmware (dload)DUB‑LX2C636 (APAC)2.67 GBAsia‑Pacific region build for Y7 Pro 2019
DUB‑LX2 8.2.0.142(C636)Full firmware (dload)DUB‑LX2C636 (APAC)2.63 GBNewer APAC build; use same‑or‑newer to avoid install fail
Huawei_Y7_Pro_DUB‑LX2_C636_QPST.zipQPST/QFIL packageDUB‑LX2C636 (APAC)3.56 GBFlash in EDL 9008 with QFIL programmer and XMLs
DUB‑LX3 8.2.0.138(C605) QPST.zipQPST/QFIL packageDUB‑LX3C605 (LATAM)1.73 GBLATAM firehose build for QFIL unbrick/restore
DUB‑LX3 8.2.0.144(C605) Dead‑Boot FixRecovery pack (EDL)DUB‑LX3C605 (LATAM)3.2 GBUse for dead boot auto‑recovery on LX3 LATAM
DUB‑LX3/L03 8.2.0.130(C45) Dead‑Boot FixRecovery pack (EDL)DUB‑LX3/DUB‑L03C45 (carrier LATAM)3.2 GBCarrier‑specific LATAM recovery pack variant
DUB‑LX1 8.2.0.152(C185) QFIL.zipQPST/QFIL packageDUB‑LX1C185 (MEA)4.2 GBUse firehose programmer included; match cust C185
DUB‑AL20 8.2.0.127(C00) all_cnFull firmware (dload)DUB‑AL20 (Enjoy 9)C00 (China)2.84 GBChina build for AL20; install via dload/eRecovery
DUB‑LX1/L21 8.2.0.147(C432) (duplicate)Full firmware (dload)DUB‑LX1/DUB‑L21C432 (Europe)4.65 GBDuplicate of EU build above for convenience
DUB‑LX3/L23 8.2.0.144(C605)Full firmware (dload)DUB‑LX3/DUB‑L23C605 (LATAM)3.10 GBLATAM customization build for SD‑card update
DUB‑L22 8.2.0.107(C636)Full firmware (dload)DUB‑L22C636 (APAC)2.63 GBAsia‑Pacific build; ensure cust alignment before flashing

Before you begin

  • Back up personal data; deep repairs and dload rewrites will erase user partitions during restore.
  • Charge to 50%+ and use a known‑good USB cable to avoid EDL interruptions or dload power loss.
  • Install Qualcomm HS‑USB QDLoader drivers and verify the device enumerates as 9008 in EDL mode.
  • Match your cust/region carefully to avoid C900 conversion and lost OTA capability post‑flash.

Quick flashing guide

QPST/QFIL (EDL 9008) — unbrick

  1. Extract the chosen Qualcomm package, e.g., Huawei_Y7_Pro_DUB-LX2_C636_QPST.zip, and install QPST/QFIL on your PC.
  2. Put phone into EDL 9008 via testpoint, then confirm Windows shows Qualcomm HS‑USB QDLoader 9008 in Device Manager.
  3. In QFIL, select the programmer (prog_emmc/prog_ufs firehose) from the package, load XMLs when prompted, and keep Download mode as Flat Build.
  4. Click Download and wait until QFIL completes without errors; the phone may reboot or remain in EDL—disconnect and boot normally.
  5. If Sahara/Firehose fails, recheck drivers, testpoint contact, and use the exact programmer from the same package variant.

For a full Qualcomm walk‑through, follow the QFIL guide and return here for model‑specific files: QFIL detailed tutorial.

Huawei dload update — full cust packages

  1. Extract a full cust build, e.g., Huawei_Y7_2019_DUB-LX1_8.2.0.176_C185.zip, to get the dload folder/update file and place it on a microSD.
  2. Power off, insert the SD card, then hold Volume Up + Volume Down + Power to start the three‑button dload update.
  3. Wait for verification and installation to finish; do not interrupt power during flash.
  4. If “Software install failed” appears, switch to the correct region/version or use eRecovery to match the device’s cust/version.

See the Huawei flashing method overview for dload/eRecovery tips, then use the exact region build above for your model: Huawei method (dload/eRecovery).


Troubleshooting notes

  • EDL/testpoint location: DUB boards expose testpoints under the back cover; short the documented pins with battery disconnected to enter 9008.
  • “Software install failed”: clear System Update app data and retry with matching cust/version, or switch from dload to EDL restore when partitions are corrupted.
  • Region drift to C900 after flashing: reflash correct cust preload/customization to regain OTA, avoiding cross‑cust mixes that trigger open‑market C900.
  • Sahara/Firehose handshake errors: typically driver, cable, or wrong programmer choice—reinstall QDLoader drivers and retry with the package’s own firehose.

Frequently asked questions

Will flashing LX1/LX3 firmware add a fingerprint reader to LX2?
No—Y7 Pro 2019 (DUB‑LX2) shipped without a fingerprint sensor, and firmware cannot add missing hardware even though LX1/LX3 support it.
Why did my phone become C900 after a flash and stop getting OTA?
C900 indicates an open‑market/cross‑cust state from mismatched region components; re‑flash the correct cust (e.g., C432/C605/C636/C185) to restore normal OTA flow.
When should I use Board Software BD 1.0.0.xx vs a full cust build?
Use Board Software BD packages when the device is hard‑bricked or only enumerates as 9008; use full cust builds via dload or QFIL when partitions are readable and region alignment is needed.
How do I enter EDL 9008 on DUB‑series boards?
Use testpoint on the mainboard to short the documented pins and connect USB; Windows should detect Qualcomm HS‑USB QDLoader 9008 before using QFIL/QPST.

Similar Posts